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74ALVC373
Octal D-type transparent latch; 3-state
Rev. 02 -- 18 October 2007 Product data sheet
1. General description
The 74ALVC373 is an octal D-type transparent latch featuring separate D-type inputs for each latch and 3-state true outputs for bus-oriented applications. A latch enable (LE) input and an outputs enable (OE) input are common to all latches. When pin LE is HIGH, data at the D-inputs (pins D0 to D7) enters the latches. In this condition, the latches are transparent, that is, a latch output will change each time its corresponding D-input changes. When pin LE is LOW, the latches store the information that was present at the D-inputs one set-up time preceding the HIGH-to-LOW transition of pin LE. When pin OE is LOW, the contents of the eight latches are available at the Q-outputs (pins Q0 to Q7). When pin OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of input pin OE does not affect the state of the latches. The 74ALVC373 is functionally identical to the 74ALVC573, but has a different pin arrangement.
2. Features
s s s s s s s Wide supply voltage range from 1.65 V to 3.6 V 3.6 V tolerant inputs/outputs CMOS low power consumption Direct interface with TTL levels (2.7 V to 3.6 V) Power-down mode Latch-up performance exceeds 250 mA Complies with JEDEC standards: x JESD8-7 (1.65 V to 1.95 V) x JESD8-5 (2.3 V to 2.7 V) x JESD8B/JESD36 (2.7 V to 3.6 V) s ESD protection: x HBM JESD22-A114E exceeds 2000 V x MM JESD22-A 115-A exceeds 200 V
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
3. Ordering information
Table 1. Ordering information Package Temperature range Name 74ALVC373D -40 C to +85 C SO20 TSSOP20 Description plastic small outline package; 20 leads; body width 7.5 mm plastic thin shrink small outline package; 20 leads; body width 4.4 mm Version SOT163-1 SOT360-1 SOT764-1 Type number
74ALVC373PW -40 C to +85 C 74ALVC373BQ -40 C to +85 C
DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm
4. Functional diagram
1 18 17 14 13 8 7 4 3 D7 D6 D5 D4 D3 D2 D1 D0 LE 11 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 OE
mna881
EN C1
19 16
11
3 15 12 9 6 5 2 4 7 8 13 14 17 18
1D
2 5 6 9 12 15 16 19
mna880
1
Fig 1. Logic symbol
Fig 2. IEC logic symbol
3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7 LATCH 1 to 8 3-STATE OUTPUTS
Q0 Q1 Q2 Q3
2 5 6 9
Q4 12 Q5 15 Q6 16 Q7 19
11 LE 1 OE
mna882
Fig 3. Functional diagram
74ALVC373_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
2 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
LE
LE LE D LE Q
mna189
Fig 4. Logic diagram (one latch)
D0 D1 D2 D3 D4 D5 D6 D7
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE OE
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
mna883
Fig 5. Logic diagram
74ALVC373_2
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Product data sheet
Rev. 02 -- 18 October 2007
3 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
5. Pinning information
5.1 Pinning
terminal 1 index area Q0 D0 OE Q0 D0 D1 Q1 Q2 D2 D3 Q3 1 2 3 4 5 6 7 8 9 20 VCC 19 Q7 18 D7 17 D6 16 Q6 15 Q5 14 D5 13 D4 12 Q4 11 LE
001aad090
2 3 4 5
20 VCC 19 Q7 18 D7 17 D6 16 Q6 15 Q5 14 D5 13 D4 12 Q4 LE 11
D1 Q1 Q2 D2 D3 Q3
6 7 8 9 GND 10 GND(1)
373A
1
OE
373A
GND 10
001aad089
Transparent top view
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.
Fig 6. Pin configuration SO20 and TSSOP20
Fig 7. Pin configuration DHVQFN20
5.2 Pin description
Table 2. Symbol D[0:7] LE OE Q[0:7] VCC GND Pin description Pin 3, 4, 7, 8, 13, 14, 17, 18 11 1 2, 5, 6, 9, 12, 15, 16, 19 20 10 Description data input latch enable input (active HIGH) output enable input (active LOW) 3-state latch output supply voltage ground (0 V)
74ALVC373_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
4 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
6. Functional description
Table 3. Functional table[1] Input OE Enable and read register (transparent mode) Latch and read register Latch register and disable outputs
[1]
Operating modes
Internal latch LE H H L L X L Dn L H l h X h L H L H X H
Output Qn L H L H Z Z
L L L L H H
H = HIGH voltage level h = HIGH voltage level one set-up time prior to the HIGH-to-LOW LE transition L = LOW voltage level l = LOW voltage level one set-up time prior to the HIGH-to-LOW LE transition X = don't care Z = High-impedance OFF-state
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO Parameter supply voltage input clamping current input voltage output clamping current output voltage VO > VCC or VO < 0 V output HIGH or LOW state output 3-state power-down mode, VCC = 0 V IO ICC IGND Tstg Ptot
[1] [2] [3]
[2] [1] [2]
Conditions VI < 0 V
Min -0.5 -50 -0.5 -0.5 -0.5 -0.5 -100 -65
Max +4.6 +4.6 50 VCC + 0.5 +4.6 +4.6 50 100 +150 500
Unit V mA V mA V V V mA mA mA C mW
output current supply current ground current storage temperature total power dissipation
VO = 0 V to VCC
Tamb = -40 C to +85 C
[3]
-
The input and output voltage ratings may be exceeded if the input and output current ratings are observed. When VCC = 0 V (power-down mode), the output voltage can be 3.6 V in normal operation. For SO20 packages: above 70 C derate linearly with 8 mW/K. For TSSOP20 packages: above 60 C derate linearly with 5.5 mW/K. For DHVQFN20 packages: above 60 C derate linearly with 4.5 mW/K.
74ALVC373_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
5 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
8. Recommended operating conditions
Table 5. Symbol VCC VI VO Recommended operating conditions Parameter supply voltage input voltage output voltage output HIGH or LOW state output 3-state power-down mode; VCC = 0 V Tamb t/V ambient temperature input transition rise and fall rate in free air VCC = 1.65 V to 2.7 V VCC = 2.7 V to 3.6 V Conditions Min 1.65 0 0 0 0 -40 Max 3.6 3.6 VCC 3.6 3.6 +85 20 10 Unit V V V V V C ns/V ns/V
9. Static characteristics
Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter VIH HIGH-level input voltage Conditions Min VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VOH HIGH-level output voltage VI = VIH or VIL IO = -100 A; VCC = 1.65 V to 3.6 V IO = -6 mA; VCC = 1.65 V IO = -12 mA; VCC = 2.3 V IO = -18 mA; VCC = 2.3 V IO = -12 mA; VCC = 2.7 V IO = -18 mA; VCC = 3.0 V IO = -24 mA; VCC = 3.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 3.6 V IO = 6 mA; VCC = 1.65 V IO = 12 mA; VCC = 2.3 V IO = 18 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 18 mA; VCC = 3.0 V IO = 24 mA; VCC = 3.0 V II input leakage current VCC = 3.6 V; VI = 3.6 V or GND 0.11 0.17 0.25 0.16 0.23 0.30 0.1 0.2 0.3 0.4 0.6 0.4 0.4 0.55 5 V V V V V V V A VCC - 0.2 1.25 1.8 1.7 2.2 2.4 2.2 1.51 2.10 2.01 2.53 2.76 2.68 V V V V V V V 0.65 x VCC 1.7 2.0 -40 C to +85 C Typ[1] Max 0.7 0.8 V V V V V Unit
0.35 x VCC V
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Product data sheet
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NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
Table 6. Static characteristics ...continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter IOZ IOFF ICC ICC CI
[1]
Conditions Min VI = VIH or VIL; VCC = 1.65 V to 3.6 V; VO = 3.6 V or GND; VCC = 0 V; VI or VO = 0 V to 3.6 V VCC = 3.6 V; VI = VCC or GND; IO = 0 A per input pin; VCC = 3.0 V to 3.6 V; VI = VCC - 0.6 V; IO = 0 A -
-40 C to +85 C Typ[1] 0.1 0.1 0.2 5 3.5 Max 10 10 10 750 -
Unit A A A A pF
OFF-state output current power-off leakage supply supply current additional supply current input capacitance
All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 C.
10. Dynamic characteristics
Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 12. Symbol tpd Parameter propagation delay Conditions Dn to Qn; see Figure 8 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V LE to Qn; see Figure 9 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V ten enable time OE to Qn; see Figure 10 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V tdis disable time OE to Qn; see Figure 10 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V
[2] [2] [2]
-40 C to +85 C Min 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.5 1.0 1.5 1.0 1.5 1.0 1.5 1.0 Typ[1] 2.5 2.0 2.3 2.2 2.8 2.1 2.4 2.3 3.0 2.4 3.0 2.3 3.4 2.2 2.8 2.7 Max 5.4 3.5 3.6 3.3 6.0 3.8 3.7 3.3 6.4 4.5 4.6 4.0 7.0 4.4 4.4 4.4
Unit
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
74ALVC373_2
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Product data sheet
Rev. 02 -- 18 October 2007
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NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
Table 7. Dynamic characteristics ...continued Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 12. Symbol tW Parameter pulse width Conditions LE pulse width HIGH; see Figure 9 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V tsu set-up time Dn to LE; see Figure 11 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V th hold time Dn to LE; see Figure 11 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V CPD power dissipation capacitance per latch; VI = GND to VCC; VCC = 3.3 V outputs HIGH or LOW state outputs 3-state
[1] [2] Typical values are measured at Tamb = 25 C tpd is the same as tPHL and tPLH. ten is the same as tPZH and tPZL. tdis is the same as tPHZ and tPLZ. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz CL = output load capacitance in pF VCC = supply voltage in Volts N = number of inputs switching (CL x VCC2 x fo) = sum of the outputs
[3]
-40 C to +85 C Min 3.8 3.3 3.3 3.3 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.7 Typ[1] 1.0 0.8 2.0 2.2 0.1 0.1 0.1 0.1 -0.1 -0.2 -0.3 -0.1 35 14 Max -
Unit
ns ns ns ns ns ns ns ns ns ns ns ns pF pF
[3]
74ALVC373_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
8 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
11. Waveforms
VI Dn input GND tPHL VOH Qn output VOL VM
mna884
VM
tPLH
Measurement points are given in Table 8. VOL and VOH are the typical output voltage levels that occur with the output load.
Fig 8. Input Dn to output Qn propagation delay times Table 8. Measurement points VM 0.5VCC 0.5VCC 1.5 V 1.5 V Output Vx 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V VOL + 0.15 V VOL + 0.15 V VOL + 0.3 V VOL + 0.3 V Vy VOH - 0.15 V VOH - 0.15 V VOH - 0.3 V VOH - 0.3 V
Supply voltage VCC
VI LE input GND tW t PHL VOH Qn output VOL VM
mna885
VM
t PLH
Measurement points are given in Table 8. VOL and VOH are the typical output voltage levels that occur with the output load.
Fig 9. Latch enable (LE) pulse width and latch enable input to output (Qn) propagation delays
74ALVC373_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
9 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
VI OE input GND t PLZ VCC Qn output LOW-to-OFF OFF-to-LOW VOL t PHZ VOH Qn output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
mna395
VM
t PZL
VM VX t PZH VY VM
Measurement points are given in Table 8. VOL and VOH are the typical output voltage levels that occur with the output load.
Fig 10. Enable and disable times
VI Dn input GND th t su VI LE input GND VM
mna887
VM
th t su
Measurement points are given in Table 8. The shaded areas indicate when the input is permitted to change for predicable output performance.
Fig 11. The data set-up and hold times for Dn input to LE input
74ALVC373_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
10 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
VI negative pulse 0V
tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW
VEXT VCC VI VO
RL
VM
VI positive pulse 0V
VM
G
RT
DUT
CL RL
001aae331
Test data is given in Table 9. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times.
Fig 12. Test circuitry for switching times Table 9. Test data Input VI 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V VCC VCC 2.7 V 2.7 V tr, tf 2.0 ns 2.0 ns 2.5 ns 2.5 ns Load CL 30 pF 30 pF 50 pF 50 pF RL 1 k 500 500 500 VEXT tPLH, tPHL open open open open tPLZ, tPZL 2 x VCC 2 x VCC 6V 6V tPHZ, tPZH GND GND GND GND
Supply voltage
74ALVC373_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
11 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 13. Package outline SOT163-1 (SO20)
74ALVC373_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
12 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c y HE vMA
Z
20
11
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
10
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 14. Package outline SOT360-1 (TSSOP20)
74ALVC373_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
13 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm
D
B
A
A A1 E c
terminal 1 index area
detail X
terminal 1 index area e 2 L
e1 b 9 vMCAB wM C y1 C
C y
1 Eh 20
10 e 11
19 Dh 0
12 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.6 4.4 Dh 3.15 2.85 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 3.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT764-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
Fig 15. Package outline SOT764-1 (DHVQFN20)
74ALVC373_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
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NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
13. Abbreviations
Table 10. Acronym CDM DUT ESD HBM MM TTL Abbreviations Description Charged Device Model Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic
14. Revision history
Table 11. Revision history Release date 20071018 Data sheet status Product data sheet Change notice Supersedes 74ALVC373_1 Document ID 74ALVC373_2 Modifications:
* * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 3: DHVQFN20 package added. Section 7: derating values added for DHVQFN20 package. Section 12: outline drawing added for DHVQFN20 package. Product specification -
74ALVC373_1
20020226
74ALVC373_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
15 of 17
NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
15.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
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(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 18 October 2007
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NXP Semiconductors
74ALVC373
Octal D-type transparent latch; 3-state
17. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 October 2007 Document identifier: 74ALVC373_2

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